Part A: Course Overview

Course Title: Semiconductor Device Fabrication

Credit Points: 12.00

Terms

Course Code

Campus

Career

School

Learning Mode

Teaching Period(s)

EEET2663

City Campus

Postgraduate

172H School of Engineering

Face-to-Face

 Sem 1 2025

Course Coordinator: Prof. Anthony Holland

Course Coordinator Phone: +61 3 9925

Course Coordinator Email: anthony.holland@rmit.edu.au


Pre-requisite Courses and Assumed Knowledge and Capabilities

There is no pre-requisite course, however, it is advantageous to have a basic knowledge of electronics. 


Course Description

The course will focus on the fabrication procedures which are used in industry to produce semiconductor devices. The topic material will be supported where practicable by laboratory/clean room demonstrations and student activities relevant to the various processes presented in lectures.

The subject material is divided into five modules as follows:

  • Introduction of basic fabrication processes, materials and clean room protocols.
  • Photolithography, masking and patterning of materials.
  • Semiconductor oxidation and diffusion.
  • Ion implantation and thermal processing.
  • Metal and dielectric deposition for contacts, gate and interconnect engineering.


Objectives/Learning Outcomes/Capability Development

Program Learning Outcomes

This course is an option course and will broadly contribute to the development of your program learning outcomes. 

For more information on the program learning outcomes for your program, please see the program guide.  

 


Upon completion of this course, you will be able to:

CLO1    Apply specialist knowledge of the clean room environment/laboratory procedures for semiconductor device (chip) fabrication.

CLO2    Deconstruct the silicon chip fabrication scheduling process utilising advanced theoretical and practical rationales.   

CLO3    Justify a process flow design based on required specialised silicon chip fabrication equipment.

CLO4    Transform circuit diagrams into integrated circuit layout patterns using software tools and advanced knowledge for silicon chip fabrication.

CLO5     Solve complex interconnected problems for optimal chip design.

CLO6    Collaborate in a team using professional behaviours, processes and standards.


Overview of Learning Activities

The course is based on a series of pre-recorded lectures covering the stated topics, There will also be lectorials, tutorials and laboratory activities. Some laboratory sessions will be delivered on campus and others online. In addition, you are expected to undertake self-paced exercises on the topic material. In summary, the delivery methods will cover the following:

Lectorial and tutorial presentations which allow student interaction and which align with recorded lecture presentations,

Self-paced exercises and problem solving work will focus on application of technical skills,

Supervised laboratory demonstrations and laboratory practice to enhance your technical competence. For students who cannot attend on campus, the demonstrations will be online. There will be simulation lab work which will be online for all students and is the focus of the lab report assessment. 


Overview of Learning Resources

Learning resources for this course include:

  • Lecture Notes (as part of course learning guide) prepared by the teaching staff.
  • Prescribed textbook/s: See the course guide available at the start of classes.

Recommended reference books: See the course guide available at the start of classes.


Overview of Assessment

Assessment Task 1: Quiz, 15%, CLO1, CLO2 and CLO3
Assessment Task 2: Test, 30%, CLO2, CLO3, CLO4 and CLO5
Assessment Task 3: Lab reports, 25%, CLO4, CLO5 and CLO6
Assessment Task 4: Written assignment, 30%, CLO3, CLO4 and CLO5

If you have a long-term medical condition and/or disability it may be possible to negotiate to vary aspects of the learning or assessment methods. You can contact the program coordinator or Equitable Learning Services if you would like to find out more.